μ-porous vacuum chucks 55
Specially designed porous chuck with three individual clamping areas, stops for part positioning and lifting
pins for easy removal of wafers.
Grid hole chuck
with finely milled
surface
Flourescent chuck, 6” diameter
Finely milled vacuum chuck for clamping wafers, clamping
area microporous material Witte MP CE100 WHITE
flatness accuracy <0,005mm
Independent vacuum
chuck.
Clamping of parts on
chuck completely free of
external supply lines.
Battery, vacuum pump,
controls, display and valves
are all integrated
